(a) (c) (b) (d) 1. part no. expression : (a) series and dimension code 2. configuration & dimensions : 3. materials : superworld electronics (s) pte ltd (a) body : ferrite (b) termination : ag/ni/sn a (b) inductance code : 1n0 = 1.0nh (c) inductance tolerance : s = 0.3nh , j = 5% , k = 10% 4. general specification : b) operating temp. : -40 c to +105 c ( include self-temp. rise ) a) storage temp. : -40 c to +105 c pg. 1 pcb pattern h g 0.50 0.10 bd 0.40 ref. 0.55 ref. 1.50 ref. ghl unit:m/m l 1.00 0.10 ac 0.50 0.10 c d a b 0.25 0.10 b ag(100%) ni(100%)-1.5um(min.) sn(100%)-3.0um(min.) l 1 m - 1 n 0 s - 1 0 (d) 10 : rohs compliant high frequency chip inductor l1m series 10.11.2011 note : specifications subject to change without notice. please check our website for latest information.
superworld electronics (s) pte ltd pg. 2 5. electrical characteristics : ( mhz ) frequency part number inductance ( nh ) test rated current dc resistance ( ? ) ( ma ) l1m-1n0s-10 1.0 100 0.10 srf (mhz) 12000 min. 500 max. max. min. q 5 l1m-1n1s-10 1.1 100 0.12 11500 500 5 L1M-1N2S-10 1.2 100 0.12 11000 500 5 l1m-1n3s-10 1.3 100 0.15 10000 500 5 l1m-1n5s-10 1.5 100 0.15 9500 500 6 l1m-1n6s-10 1.6 100 0.17 9000 500 6 l1m-1n8s-10 1.8 100 0.17 8500 500 6 l1m-2n0s-10 2.0 100 0.18 8300 500 6 l1m-2n2s-10 2.2 100 0.18 8000 500 6 l1m-2n4s-10 2.4 100 0.20 7800 500 6 l1m-2n7s-10 2.7 100 0.20 7500 500 6 l1m-3n0s-10 3.0 100 0.22 7200 400 6 l1m-3n3s-10 3.3 100 0.22 7000 400 6 l1m-3n6s-10 3.6 100 0.25 6800 400 6 l1m-3n9s-10 3.9 100 0.25 6500 400 6 l1m-4n3s-10 4.3 100 0.28 6300 400 6 l1m-4n7s-10 4.7 100 0.28 6000 400 6 l1m-5n1s-10 5.1 100 0.30 5800 400 6 l1m-5n6s-10 5.6 100 0.30 5700 400 6 l1m-6n2s-10 6.2 100 0.35 5600 400 6 l1m-6n8 -10 6.8 100 0.35 5500 400 6 l1m-7n5 -10 7.5 100 0.38 5000 350 6 l1m-8n2 -10 8.2 100 0.38 5000 350 6 l1m-9n1 -10 9.1 100 0.42 4800 350 6 l1m-10n -10 10 100 0.42 4700 350 6 l1m-12n -10 12 100 0.47 4300 350 6 l1m-15n -10 15 100 0.50 4000 300 6 l1m-18n -10 18 100 0.60 4000 250 6 l1m-22n -10 22 100 0.70 3500 200 6 l1m-27n -10 27 100 0.80 3000 200 6 l1m-33n -10 33 100 0.90 2500 200 6 l1m-39n -10 39 100 1.00 2000 200 6 high frequency chip inductor l1m series 10.11.2011 note : specifications subject to change without notice. please check our website for latest information. l1m-47n -10 47 100 1.20 1800 200 6
l1m-56n -10 56 100 1.30 1500 200 6 superworld electronics (s) pte ltd pg. 3 5. electrical characteristics : ( mhz ) frequency part number inductance ( nh ) test rated current dc resistance ( ? ) ( ma ) srf (mhz) min. max. max. min. q l1m-68n -10 68 100 1.50 1400 150 6 l1m-82n -10 82 100 1.80 1300 150 6 l1m-r10 -10 100 100 2.20 1100 100 6 l1m-r11 -10 110 100 2.70 1100 100 6 l1m-r12 -10 120 100 3.00 1100 100 6 : j = 5% , k = 10% high frequency chip inductor l1m series 10.11.2011 note : specifications subject to change without notice. please check our website for latest information.
10 100 1000 10000 frequency(mhz) 0.1 1 10 100 1000 i n d u c t a n c e ( n h ) mgi 10 05f l vs fr e q. 1. 0n 2. 2n 4. 7n 10n 33n 100n 10 100 1000 10000 frequency(mhz) 1 10 100 q mgi 100 5f q vs freq. 1. 0n 2.2 n 4. 7n 10n 33 n 100n superworld electronics (s) pte ltd pg. 4 6. characteristics curves : inductance v.s. frequency characteristics q v.s. frequency characteristics high frequency chip inductor l1m series 10.11.2011 note : specifications subject to change without notice. please check our website for latest information.
superworld electronics (s) pte ltd pg. 5 7. re li abil it y & te st condition : bending 40(1.575) not be damaged by the forces applied on the the terminal electrode & the dielectric must fl ex ture s trength 100(3.937) 45(1.772) right conditions. 45(1.772) 20(.787) s ol der a c hi p on a tes t s ubs trate, bend the substrate by 2mm (0.079in) and return. test condition performance not be damaged by the forces applied on the the terminal electrode & the dielectric must more than 95% of the terminal electr ode refer to standard electrical characteristics list 10 0.5 seconds 60 seconds termi nal s trength solderability right conditions. w should be covered with solder. 60 seconds preheating 245 c 150 c 4 1.0 seconds cooling dipping natural solder heat resistance temperature rise test electrical characteristics test rated current inductance (ls) preheating 260 c 150 c dipping cooling natural solder : sn-cu0.5 flux for lead free: rol0 d i p ti me : 4 1sec. preheat : 150 c, 60sec. s ol der temperature : 245 5 c 2. temperature measured by digital surface thermometer. flux for lead free: rol0 dip time : 10 0.5sec. preheat : 150 c, 60sec. solder : sn-cu0.5 s ol der temperature : 260 5 c 1. applied the allowed dc current. a gi l ent e4991 no mechanical dam age. r emai ni ng termi nal el ec trode : 75% min. item rated current < 1a t 20c max rated current 1a t 40c max R dc power supply over rated current requirements, there will be some risk q factor a gi l ent4287 dc resistance a gi l ent 4338 a gi l ent16192 the duration of the applied forces shall be 60 (+ 5) sec. for l series : 1.0 5 6 7 1.0 1.5 2 3 4 0.6 0.5 1.0 > 30 size force (kfg) time (sec) 10.2 high frequency chip inductor l1m series 10.11.2011 note : specifications subject to change without notice. please check our website for latest information.
superworld electronics (s) pte ltd pg. 6 not be allowed. appearance : cracking, shipping & any other defec ts harmful to the c haracteristics should the ferrite should not be dam aged by forces appl i ed on the ri ght condition. random vibration test bending str ength item 1.0(0.039) r0.5(0.02) mutually perpendicular directions (total 9hours). amplitude : 1.52mm frequency : 10-55-10hz for 15 min. directions & times : x, y, z directions for 15 min. this cycle shall be performed 12 times in each of three a performance test condition chip temperature life testing at high h umi di ty : 90~95% rh. temperature : 60 2 c d urati on : 504 8hrs duration : 1008 12hrs applied current : rated current temperature : 105 2 c measured at room temperature after placing for 2 to 3hrs. measured at room temperature after placing for 2 to 3hrs. humidity measured : 500 times appearance : no dam age. phase inductance : within 10%of initial value. low temperature s torage test thermal shock number of cycles : 500 step2 : +105 2 c 30 5 min. d urati on : 500 8hrs temperature : -40 2 c measured at room temperature after placing for 2 to 3hrs. measured at room temperature after placing for 2 to 3hrs. -40 2 c 2 1 30 5 step1 : -40 2 c 30 5 min. condition for 1 cycle temperature ( c) times (min.) height of 75cm. drop 10 times on a concrete floor from a drop a. no mechanical damage b. inductance change: within 30%. 7. re li abil it y & te st condition : room temp. 0.5 Q appearance : no dam age. inductance : within 10%of initial value. derating curve for the ferrite chip bead which withstanding current over 1.5a, as the operating temperature over 85 c, the derating current information is necessary to consider with. for the detail derating of current, please refer to the derated current vs. operating temperature curve. 2.5 2.70 (0.106) 7 0.80 (0.033) mm (inches) 1.40 (0.055) 2.00 (0.079) 3 4 5 s eri es name 2 1.0 2.5 0.3 p-kgf 6 q : within 20%of initial value. q: within 20%of initial value. 3 +105 2 c 30 5 1a 1.5a 3a 2a 6a 5a 4a 4 5 6 2 3 1 0 derating derated current(a) operat ing t emperature(?c) 125 85 operating t emper atur e( ) high frequency chip inductor l1m series 10.11.2011 note : specifications subject to change without notice. please check our website for latest information.
superworld electronics (s) pte ltd pg. 7 8. soldering and mounti ng : 8-1. recommended pc board pattern if use wave soldering is there will be some risk. 8-2.3 soldering iron : 8-2.1 lead free solder re-flow : note. by the difference in coefficients of expansion between solder, chip and substrate. the terminations are suitable for re-flow mildly activated rosin fluxes are preferred. the minimum amount of solder can lead to damage from the stresses caused recommended temperature profiles for re-flow soldering in figure 1. products attachment with soldering iron is discouraged due to the inherent process control limitations. in the event that a) preheat circuit and products to 150 c. b) 350 c tip temperature (max) 60~180s figure 1. re-flow soldering : 3 times max 60~150s c) never contact the ceramic with the iron tip a soldering iron must be employed the following precautions are recommended. for iron soldering in figure 2. temperature c 150 preheating note : 8-2. soldering e) use a 20 watt soldering iron with tip diameter of 1.0mm d) 1.0mm tip diameter (max) s olde ring cooling natural under mechanical stress as warping the board. the mechanical stress to prevent failure. products shall be positioned in the sideway direction against pc board should be designed so that products are not sufficient figure 2. iron soldering times 1 times max g rad ual cooling temperature c over 1min. time(sec.) 350 150 preheating soldering cooling natural 20~40s 0.55 1.50 0.40 200 217 tp(260 c/40s max.) 4 80s max. 25 within 4-5s re-flow soldering temperatures below 240 degrees, there will be unwitting risk soldering systems. if hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. f) limit soldering time to 4~5sec. high frequency chip inductor l1m series 10.11.2011 note : specifications subject to change without notice. please check our website for latest information.
superworld electronics (s) pte ltd pg. 8 may cause the failure of mechanical or electrical performance. solder shall be used not to be exceed as shown in fig. 4. accordingly increasing the solder volume, the mechanical stress to product is also increased. exceeding solder volume figure 4 r ec ommendable upper limit t 8-3. solder volume minimum fillet height = soldering thickness + 25% product height high frequency chip inductor l1m series 10.11.2011 note : specifications subject to change without notice. please check our website for latest information.
9. packaging information : superworld electronics (s) pte ltd pg. 9 9-1. reel dimension 7" x 12mm r0.5 r10.5 13.5 0.5 7" x 8mm d b 7" x 8mm c 1 2 0 7" x 12mm r1.9 2 0.5 a 178.0 2.0 178.0 2.0 60.0 2.0 b(mm) 60.0 2.0 13.5 0.5 9.0 0.5 a(mm) type 13.5 0.5 13.5 0.5 c(mm) d(mm) d1:1 0.1 f:3.5 0.05 p2:2 0.05 p e:1.75 0.1 po:4 0.1 3(09) size 3(12) w:8.0 0.1 bo section a-a ko ao a 5 4(11) t a d:1.5+0.1 2 4.0 0.1 0.22 0.05 1.04 0.10 1.42 0.10 2.25 0.10 1.27 0.10 1.45 0.10 1.55 0.10 3.42 0. 10 2.77 0. 10 3.50 0.10 2.35 0.10 1.88 0.10 1.50 0.10 4.0 0.1 0.22 0.05 4.0 0.1 4.0 0.1 0.22 0.05 0.22 0.05 1.05 0.10 ko(mm) bo(mm) 1.95 0. 10 1.05 0. 10 ao(mm) p(mm) 4.0 0.1 0.23 0.05 t(mm) material of taping is plastic 1.0 0.10 1.0 0.10 1.0 0.10 1.0 0.10 none d1(mm) 2.0 0.1 p(mm) 4.0 0.1 4.0 0.1 0.62 0.03 1.50 0.05 1.05 0.05 1.85 0.05 2 3(09) 2.30 0.05 1 size bo(mm) 1.12 0.03 0.95 0.05 0.95 0.05 ko(mm) 0.60 0.03 ao(mm) none 0.95 0.05 0.95 0.05 none t(mm) 0.60 0.03 d1(mm) none p po:4 0.1 p2:2 0.1 f:3.5 0.1 e:1.75 0.1 ao d:1.56 +0.1 -0.05 bo w:8.0 0.1 ko t 2.0 0.05 p(mm) 0.38 0.05 0 size bo(mm) 0.68 0.05 ko(mm) 0.50max ao(mm) t(mm) 0.50max d1(mm) none material of taping is paper p po:4 0.1 p2:2 0.1 f:3.5 0.1 e:1.75 0.1 ao d:1.50 +0.1 -0.00 bo w:8.0 0.3 ko t 9-2 tape dimension / 8mm 4(09) 1.04 0.10 3.40 0. 10 1.77 0. 10 4.0 0.1 0.22 0. 05 1. 0 0.10 series l l series l series high frequency chip inductor l1m series 10.11.2011 note : specifications subject to change without notice. please check our website for latest information.
superworld electronics (s) pte ltd pg. 10 9-2.1 tape dimension / 12mm p f:5.5 0.05 d1:1.5 0.1 a e:1.75 0.1 po:4 0.1 d:1.5+0.1 a size w:12.0 0.1 bo section a-a ko ao p2:2 0.05 t 6 1.93 0.1 ko(mm) ao(mm) bo(mm) 4.95 0.1 1.93 0.1 p(mm) t(mm) 4.0 0.1 0.24 0.05 application notice a) products should be handled with care to avoid damage or contamination from perspiration and skin oils. c) bulk handling should ensure that abrasion and mechanical shock are minimized. b) the use of tweezers or vacuum pick up is strongly recommended for individual components. c) the packaging material should be kept where no chlorine or sulfur exists in the air. b) recommended products should be used within 6 months from the time of delivery. a) temperature and humidity conditions : -10~ 40 c and 30~70% rh. 2. transportation : 1. storage conditions : to maintain the solderabililty of terminal electrodes : base tape 9-4. tearing off force top cover tape 165 to 180 f bulk (bags) chip size chip / reel inner box middle box carton 9-3. packaging quantity 30000 125000 62500 12000 40000 20000 50000 75000 150000 2500 12500 4000 1000 75 15000 3000 4(11) the force for tearing off cover tape is 15 to 60 grams in the arrow direction under the following conditions. teari ng speed room humidity room temp. ( c) 5~35 (%) 45~85 room atm 860~1060 (hpa) 300 (mm/min) 200000 200000 100000 100000 150000 100000 200000 50000 100000 20000 2 4000 20000 10000 2000 4000 3(09) 3(12) d1(mm) 1.5 0.1 7 1.85 0.1 4.95 0.1 3.66 0.1 8.0 0.1 0.24 0.05 1.5 0.1 300000 500000 250000 50000 1 10000 - 750000 375000 75000 0 15000 20000 80000 40000 2000 8000 6 50000 75000 150000 3000 15000 4(09) series l high frequency chip inductor l1m series 10.11.2011 note : specifications subject to change without notice. please check our website for latest information.
|
